Thin-film adhesion: A comparative study between colored picosecond acoustics and spontaneous buckles analysis

This paper presents some quantitative measurements of the adhesion energy thin WTi films deposited on Si substrate. Two different techniques are applied to same sample series. One is a mechanical test based analysis spontaneously formed defects. The second acoustic waves whose reflection at interface between thin-film and substrate sensitive adhesion. An excellent correlation obtained both approaches: measured by buckles coefficient picosecond acoustics. approach offers several advantages among which non-destructive character, compatibility with complex stacks sensitivity detect anomaly even if no defect formed.